IEC 63378-3 Ed. 1.0 b - Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis - 2025 - PDF
Download StandardIEC 63378-3 Ed. 1.0 b - Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis - 2025 - PDF
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by International Electrotechnical Commission
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Format: PDFLanguage: EnglishEdition: 1Publisher: IECPublication Date of the Electronic Edition: 5/1/2025
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ISBN: IEC 63378-3 Ed. 1.0 b_2025, 9782832703991
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